A new chapter in the localization of core components: J-Link Electronics' first advanced process SiC automotive power module production line in Anhui Province officially goes offline

Release time: 2025-02-11

Source:

On the morning of February 11th, witnessed by leaders of Hefei Economic Development Zone, representatives of strategic investors, and over a hundred guests from dozens of leading enterprises in new energy vehicles and eVTOL aircraft, the offline ceremony of J-Link Electronics' first advanced process SiC automotive power module production line in Anhui Province was held in the Anhui Volkswagen Core Parts Industrial Park and achieved complete success.

 

This milestone marks a new stage in the technological breakthrough and industrialization process of J-Link Electronics in the field of new energy core components, and will also inject strong momentum into the independent, controllable, and high-quality development of Anhui Province's new energy industry chain.

 

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From left to right: Liu Shi, Pan Yishan, Zhang Bingli, Chen Haibin, Chen Zhaoyin, Sun Hongfei, Wei Peng, Chu Jianying, Li Buxing

 

Sun Hongfei, Director of the Investment Promotion Bureau of Hefei Economic Development Zone, Pan Yishan, Head of the School of Modern Industry at Hefei University of Technology and Chairman of Hefei Intelligent Connected Vehicle Innovation Center, Xue Songbai, Chief Technology Officer of Jilv Fly Changkong, Liu Shi, General Manager of Guoyuan Equity Investment Department, and Chen Haibin, Procurement Director of Anhui Shenxiang Technology Co., Ltd., respectively gave themed presentations on government enterprise collaboration, school enterprise cooperation, customer, and capital strategic cooperation. Chen Zhaoyin, Chairman of Hefei J-Link Automotive Electronics Co., Ltd., delivered a concluding speech.

 

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Sun Hongfei, Director of Investment Promotion Bureau of Hefei Economic Development Zone

 

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Pan Yishan, Head of the School of Modern Industry at Hefei University of Technology and Chairman of the Hefei Intelligent Connected Vehicle Innovation Center

 

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Xue Songbai, Chief Technology Officer of Jilv Fly Changkong

 

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Liu Shi, General Manager of Guoyuan Equity Investment Department

 

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Chen Haibin, Procurement Director of Anhui Shenxiang Technology Co., Ltd

 

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Hefei J-Link Automotive Electronics Co.,Ltd. Chairman Chen Zhaoyin

 

During the ceremony, the attending guests visited the J-Link Electronics technology exhibition hall and the SiC power module production line intelligent workshop, and highly recognized J-Link Electronics' achievements in process accuracy, quality control standards, and digital management, and reached a willingness to cooperate to jointly promote the large-scale application of SiC modules in the next generation of vehicle models and models.

 

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J-Link Electronics Technology Exhibition Hall

 

As the "heart" of new energy vehicles and eVTOL aircraft power systems, SiC power modules are key components for improving overall energy efficiency and range of products. J-Link Electronics, with years of technological accumulation, focuses on the research and development of third-generation semiconductor materials. The SiC automotive power module production line that has been taken offline this time, with "ultra precision, ultra reliability, ultra flexibility, and ultra environmental protection" as its core competitiveness, directly targets the pain points in the current SiC power module packaging industry.

 

Innovative equipment ecosystem: Key process equipment such as chip hot stamping equipment, silver sintering equipment, vacuum welding equipment, bonding equipment, terminal welding equipment, etc., all adopt internationally leading packaging equipment manufacturers. At the same time, based on the current pain points in the SiC power module packaging industry, we will collaborate with industry equipment giants to develop targeted improvements and enhancements to the equipment, resulting in more stable equipment, higher product yield and quality;

 

Advanced packaging technology: using pressure sintered silver process combined with DTS copper wire bonding, high reliability and low stray inductance. NTC and heat dissipation bottom plate adopt soldering technology, which simplifies the process flow, does not require cleaning, and is more environmentally friendly;

 

Smart Quality Control System: Conduct comprehensive performance testing and reliability evaluation on packaged modules to ensure that product quality and performance meet design requirements; ‌

 

Flexible intelligent manufacturing mode: adopting the "intelligent island+human-machine collaboration" architecture, each process equipment adopts modular design in the form of islands, combining automation and semi automation. While achieving automation, digitization, and intelligence, it can meet the increasingly changing product design and growing market demand. The equipment is more flexible and the utilization rate is higher.

 

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J-Link Electronics SiC Power Module Production Line

 

The entire production line, with its core competitive advantage, can meet the high reliability requirements of power system core power components in fields such as 800V high-voltage platform vehicles and eVTOL aircraft. After the comprehensive construction and delivery of the production line, the annual production capacity can reach one million units, becoming an important support for the vertical integration layout of J-Link Electronics' supply chain.

 

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In the future, J-Link Electronics will continue to provide high-performance and cost-effective domestic solutions for domestic and foreign new energy vehicle companies, eVTOL aircraft manufacturers, Tier 1/2 customers, and strive to become a globally renowned mainstream supplier of SiC power modules and high-voltage electronic control electric drives.

 

J-Link Electronics sincerely looks forward to building communication bridges with partners from all walks of life, exploring new paths of integrated development together, drawing a blueprint for collaborative development with practical actions, and working together to create a new situation of mutual benefit and win-win.