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Hefei J-Link Automotive Electronics Co.,Ltd. Home Product Introduction SiC Series Power Modules
MCU & EDS SiC Series Power Modules

Six-pack HybridPack Drive SiC Module

Six-pack HybridPack Drive SiC Module
Product Highlights
AQG-324 vehicle grade reliability certification, low on resistance, low parasitic inductance, high power cycle life, double-sided pressure sintered silver process combined with DTS copper wire bonding, internal freewheeling diode with extremely low reverse recovery charge, no threshold voltage conduction characteristics, excellent gate oxide layer reliability, strong short-circuit avalanche resistance.

 

Product parameters

BVdss

 1200V

Iout@65℃@8L/min

 450Arms/580Arms@800V

Id,pulse

 1000A/1400A

Vgss

 -4~+18V

Lstray

 8.5nH

Rds(on)

 typ. 2.3mΩ/1.7mΩ (Tvj=25°C)

Half Bridge Direct Cooled Molded SiC Module

Half Bridge Direct Cooled Molded SiC Module
Product Highlights
The pressure sintered silver process combined with DTS copper wire bonding has high reliability; Stray inductance is about 5nH low; Vacuum plastic sealing technology improves product sealing and has wide environmental applicability; Half bridge replacement is convenient, and the combination flexibility is high

 

Product parameters
BVdss 1200V
Iout@65℃@8L/min 480Arms/620Arms@850V
Id,pulse 1000A/1400A
Vgss -4~+18V
Lstray 5nH
Rds(on) typ. 2.3mΩ/1.7mΩ (Tvj=25°C)